I managed to get some solder paste (it was backordered, had to wait a month or so) (http://uk.farnell.com/jsp/search...)
So I tried the 'skillet' technic I've seen in several places on the intraweb. I applied a mini-drop of the thing, put it on the skillet, and tried to roughtly follow the recommended thermal profile...
And it reflows, but badly... I have to wait until the board is about 270C (about 30C+ more than the specs) and the result is 'grainy'.
Any suggestion ? If I get that to work there won't be any limits to the parts I can start using.. mwahaha :D