Seems like years ago we were doing 74xx DIP designs and ran the VCC and GND around the rows of IC's, making a big loop in the process. Now with SMD and different sizes and orientations, the power run is going everywhere. Which is the better practice?
Just place the run where it's needed? (power1)
Or try to close that loop for better power distribution? (power2).
Or does it matter either way?
If it's number 2, I find it's difficult to do with Eagle since once all the points are wired, you can't add extra traces to that signal. Unless there's a trick I don't know about.