I am going to be updating a PCB, and would like review the thermal relief especially on connectors.
Till now i have always use "Direct Connect" on my rules which makes a pin on a connector or a component pad connector directly onto copper pour such as GND or VCC. And example is shown below. RED is GND and Blue is VCC.
I have not experience much issues on SMD components,but find it difficult when soldering connectors.
This would mean, we would need to add a thermal relief. but what should ideal width be? Should it be 0.2mm or much higher such as 0.5mm?
Is it recommended have have thermal relief on SMD components?