The ExpressPCB footprint for a 0603 chip is slightly narrower than the chip and the overall length is only slightly longer than the chip.
Panasonic's datasheet says the narrower width is proper for flow soldering but for reflow soldering, the land should be the same width or slightly wider than the chip.
I don't know the difference between flow and reflow soldering, but a little wider and longer should make it easier for me to place and solder the chip with an iron.
I like big pads so my iron can hit the pad without hitting the chip. I'm thinking of making a footprint with bigger lands.
On the other hand, these lands might be good if I was to use hot air. I have hot air on my soldering station but I've only used it to shrink some heat-shrink tubing. It works great for that. :) I'd like to try it for soldering sometime.
Do you guys use hot air or an iron?