In the previous version of the datasheet for the bga package, there was a separation between the different ground pins: GNDANA, GNDIO, GNDCORE; GNDPLL. Why in the new version has this separation been eliminated?
Are the different gnd separated inside the chip with LQFP144 format?
If yes, I'd like to know what the pins are for the different gnd types.
I need it to reduce noise on the dac and adc pins.