Hi guys,
In some of the boards I check out the vias are flooded - completely connected to the surrounding copper pour. But on others, the vias are connected through a thermal relief patern and on one both methods were used.
See:
(warning: Gargantuan image)
http://bunniefoo.com/ntw/ntw_dec...
http://bunniefoo.com/ntw/ntw_dec...
Bottom of the picture.
Is there any reason one way or the other? Cause, I can't think of any reason not to flood them, when they aren't used for soldering.
Thanks,
David