I've finished drawing the schematic for my weather data logger in Eagle and am starting my very first PCB layout. I have a few questions:
1. The board will be two layers. Should I put the ground plane on the front (component) side or the back of the board?
2. Should I use both a ground plane and a power plane (3.3v), or is a ground plane sufficient?
3. I have one 100nF ceramic chip cap per IC for bypass--is this enough, or do I need more?