UC3B0256 QFN-64 package thermal pad size !!!

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#1
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hi,

from its datasheet, the QFN-64 package's exposed thermal pad's size has a big variance:
from min 3.25*3.25mm to max 7.45*7.45mm, but there is no typical value.

So anyone has a precise drawing for this QFN-64?

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Maybe you can find some information here:

http://en.wikipedia.org/wiki/QFN

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but i don't think all the QFN packages got the same pad size.

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It are standarised packeges as far as i know. correct me if i am wrong. When you take for instance a BGA356 pakage al devices from diffent supplieres use the same outline and pitch. why not for QFN.

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if it's the same for everyone, then why the variance on UC3B's datasheet can be this big?

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I checked some parts that use QFN64 housing and you are right each device has a different thermal pad size. Pherhaps you can send an email to avr32@atmel.com for technical support.

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i got reply from ATMEL that the thermal pad is 6*6mm:

Here is the right size of thermal pad :

D2 min = E2 min = 5.9 mm
D2 typ = E2 typ = 6.0 mm
D2 max = E2 max = 6.1 mm