from its datasheet, the QFN-64 package's exposed thermal pad's size has a big variance:
from min 3.25*3.25mm to max 7.45*7.45mm, but there is no typical value.
So anyone has a precise drawing for this QFN-64?
Maybe you can find some information here:
but i don't think all the QFN packages got the same pad size.
It are standarised packeges as far as i know. correct me if i am wrong. When you take for instance a BGA356 pakage al devices from diffent supplieres use the same outline and pitch. why not for QFN.
if it's the same for everyone, then why the variance on UC3B's datasheet can be this big?
I checked some parts that use QFN64 housing and you are right each device has a different thermal pad size. Pherhaps you can send an email to email@example.com for technical support.
i got reply from ATMEL that the thermal pad is 6*6mm:
Here is the right size of thermal pad :
D2 min = E2 min = 5.9 mm
D2 typ = E2 typ = 6.0 mm
D2 max = E2 max = 6.1 mm
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