I have stencil for my PCB, but on certain places, there are small solder balls generating. Does this indicate that i need to reduce the thickness and aperture of my stencil pads?
I thought that was caused by the paste having absorbed too much water vapour.
I did once find an excellent site that detailed common soldering faults, the causes and steps for prevention.
I cant find it now, it's gone from my history and I didn't bookmark it - Bugger.
Maybe that could be the reason.
I am new to stencil usage.
I have stencil for my PCB, but on certain places, there are small solder balls generating.
Take a look at: "How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process"
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