In a week or two I'm going to bring up a new board I've designed based on an ATMega32A. It has a 5V regulator fed from an external 12V supply, 16 MOSFETS, an RS485 driver, and some connectors. It's all surface mount. This is a large board for me, and with my previous, smaller boards, I'd hand-solder a piece (like the regulator), test, then hand-solder some more. Once I'd validated the board, I'd make more by reflowing them in a toaster oven. With this one, it would be nice to not have to hand-solder all those MOSFETs, so I was wondering what would happen if I reflowed them after hand-soldering other parts? Would the hand-soldered parts come unsoldered and, if so, would it matter? They're just going to be sitting there on their pads and the solder would solidify again once the board cooled. I could also reflow the MOSFETS first, but I'd prefer not to do that since I may encounter a problem somewhere else on the board before I need those parts. Thanks for any thoughts.
Joined: Tue. Apr 1, 2003
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