SAMD10DS and SAMD10DM

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What does S and M stand for?

Last Edited: Thu. Oct 15, 2015 - 11:33 PM
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Where did you get those part numbers from? They don't seem to be formatted according to the ordering code. The closest thing I can imagine is a package type (M - QFN, S - SOIC).

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From include files. Let's rephrase the questions. OK, what does S & M stand in ATSAMD10D14AM and ATSAMD10D14AS?

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There is a also C. C is at least mentioned on the "main page" http://www.atmel.com/products/mi...
But I don't see anything regarding S & M.

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That's package type, for sure. It is impossible to put "-" in the #define, so package type simply concatenated to the rest of the part name.

 

Why "SS" got shortened to "S", I don't know, probably for symmetry. It is also hard to say why it is "SS" and not "S" in a first place.

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diff ATSAMD10D14AM.xml ATSAMD10D14AS.xml - different signatures and many other differences! Definitely quite different from what I got used with AVR8.

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Actually all the differences support my theory - there is more pins on the AM part. Device ID is different, of course. But device ID is programmed during the manufacture of the final device, so it is still the same die, but you need to be able to differentiate the devices for the sake of debugger.

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And here is the final proof:

 

Quote:

    <variant ordercode="standard" package="QFN24_capless" speedmax="+0" tempmax="+0" tempmin="+0" vccmax="+0" vccmin="+0"/>

and

Quote:

    <variant ordercode="standard" package="SOIC20_capless" speedmax="+0" tempmax="+0" tempmin="+0" vccmax="+0" vccmin="+0"/>

NOTE: I no longer actively read this forum. Please ask your question on www.eevblog.com/forum if you want my answer.