I noticed that the new package that the manufactorer insists is sot23-6 (6 pins) rather than sot 23 (3pins) 2 back 1 front.
As sot23 has 2 back and 1 front the effective distance between pads will be sufficient (2mm)
But this damn sot23-6 has all the pins togethar and the pad spacing is much lower than SOIC (0.6mm free space between pads). It has only 0.4mm free space between pads.
It is in the design phase. I use self made time/pressure controlled solder dispenser and self made PID multi step reflow oven.
Anyone experience with sot23-6 with similar equipment.