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stevech
PostPosted: Dec 17, 2012 - 08:40 PM
Raving lunatic


Joined: Dec 18, 2001
Posts: 4700


Interesting w.r.t. the debate on if/when ARM chips might displace 8 bit micros...

Said by an Atmel competitor (xxx's redact their part numbers):
Quote:
There's been a lot of talk about ARM taking over the embedded world, but the reality is that there is still a hefty chasm between 8-bit applications and entry level M0 devices like the xxx chips, and it goes beyond SW or MCU cores. Many low-cost products where 8-bit dominates are still assembled by hand or via wave-soldering with packages like TSSOP or DIP, whereas (with some rare exceptions like the DIP xxx) ARM has largely been confined to more modern, machine-placeable packages like QFN, QFP or BGA. Price has also been an issue, even with the $1 xxx chips breaking new ground at the time of their release (though they're still an impressive value today!), but those rules definately change with the $0.39 xxx chips in very familiar DIP and TSSOP packages.


This is a rationale for DIP packages I hadn't considered.
 
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toalan
PostPosted: Dec 18, 2012 - 06:18 PM
Posting Freak


Joined: Jul 21, 2005
Posts: 1373


Never considered the package for hand or wave soldering, can not relate to it but it does make economic sense.
 
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clawson
PostPosted: Dec 18, 2012 - 06:59 PM
10k+ Postman


Joined: Jul 18, 2005
Posts: 62220
Location: (using avr-gcc in) Finchingfield, Essex, England

Quote:

This is a rationale for DIP packages

In my previous companies use of AVR (mega8/mega16) sing about 2 million devices per annum they were mounted on a single sided front panel (of consumer electronic device) board and that was wave soldered so DIP was the only real option for us.

BTW I bet you are talking about NXP LPC 800 ? I have the eval board for them coming down the chimney when Santa visits I hope!

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